Product PCN



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  • PCN No#:2019-04-01C-01


    Description:

    MOSFET : SSD15P10-C
    Description of Change(s): In order to enhance the effectiveness of the product, we change the wafer size from 6-inch to 8-inch.
    Download:  pdf

2019-04-01



  • PCN No#:2019-04-01C-02


    Description:

    MOSFET : SPR14P10-C
    Description of Change(s): In order to enhance the effectiveness of the product, we change the wafer size from 6-inch to 8-inch.
    Download:  pdf

2019-04-01



  • PCN No#:2018-10-24C-01


    Description:

    MOSFET : SCG3139K-C
    Package: SOT-523
    Description of Change(s): In order to enhance the effectiveness of the product, wafer size change from 6-inch to 8-inch.
    Download: pdf

2018-10-24



  • PCN No#:2018-09-04C-01


    Description:

    Diode
    Package : SMA/SMB/SMC
    Affected Product(s) : Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2018-09-04



  • PCN No#:2018-08-24C-01


    Description:

    Liner LDO Regulator : STP1117Sxx Series
    Package: SOT-223
    Description of Change(s): In order to unify the quantity of reels , so we change the quantity.
    Download: pdf

2018-08-24



  • PCN No#:2018-06-29C-01


    Description:

    Package : GBJ/GBL/GBP/GBU/JB/KBJ/KBP
    Affected Product(s) : New series bridge rectifier .
    Description of Change(s): To meet UL's requirement that any given part number should correspond to only one part. thus, we change the marking.
    Download: pdf

2018-06-29



  • PCN No#:2018-05-04C-01


    Description:

    Package : SOD-123
    Affected Product(s) : SOD-123 Package of Schottky, Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2018-05-04



  • PCN No#:2018-05-04C-02


    Description:

    Package : SOD-323
    Affected Product(s) : SOD-323 Package of Schottky, Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2018-05-04



  • PCN No#:2018-05-04C-03


    Description:

    Package : SOD-123
    Affected Product(s) : SOD-123 Package of Low VF Schottky, Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2018-05-04



  • PCN No#:2018-04-13C-01


    Description:

    Package : TO-277D , TO-277B
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of material, and enhance the speed of delivery, thus, we add a new clip vendor.
    Download:  pdf

2018-04-13



  • PCN No#:2017-12-08C-01


    Description:

    Transistor
    Package : SOT-723
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-12-08



  • PCN No#:2017-12-08C-02


    Description:

    Transistor
    Package : SOT-223
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-12-08



  • PCN No#:2017-12-08C-03


    Description:

    MOSFET
    Package : SOP-8
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-12-08



  • PCN No#:2017-12-08C-04


    Description:

    Small Signal Diode
    Package : WBFBP-02C
    Affected Product(s) : WBFBP-02C Package of Small Signal Diode, Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-12-08



  • PCN No#:2017-12-08C-05


    Description:

    Diode
    Package : WBFBP-02C
    Affected Product(s) : WBFBP-02C Package of ESD Protection Diode, Such as attachments.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-12-08



  • PCN No#:2017-05-25C-01


    Description:

    MOSFET
    Package : SC-59
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-02


    Description:

    Transistor
    MMBT3904
    Affected Product(s) : MMBT3904
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-03


    Description:

    Transistor
    MMBT3906
    Affected Product(s) : MMBT3906
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-04


    Description:

    MOSFET
    Package : SOT-723
    Affected Product(s) : SOT-723 Package of Mosfet, inclouding SSN3043. SSN3134K. SSN3139K and SSN3541.
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-05


    Description:

    DIODE
    Package : SOD-123JD
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-06


    Description:

    DIODE
    Package : SMAM
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-05-25C-07


    Description:

    MOSFET
    Package : SOT-89
    Affected Product(s) : See Attachment
    Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
    Download:  pdf

2017-05-25



  • PCN No#:2017-02-03C-01


    Description:

    Package : SOP-8
    Affected Product(s) : See Attachment
    Description of Change(s): In order to improve Production efficiency for product .Tapping Leader Size 13 inch (Quantity:2.5K ) to 13 inch (Quantity:4K ).
    Download:  pdf

2017-02-03



  • PCN No#:2017-01-10C-01


    Description:

    Package : SOT-223
    Affected Product(s) : See Attachment
    Description of Change(s): In order to improve Production efficiency for product .Tapping Leader Size 7 inch (Quantity:1K ) to 13 inch (Quantity:2.5K ).
    Download:  pdf

2017-01-10



  • PCN No#:2016-12-20C-01


    Description:

    Mosfet & Transistor : See Attachment
    Description of Change(s): In order to improve the product traceability and anti-counterfeiting, we change the marking.
    Download: pdf

2016-12-20



  • PCN No#:2016-05-03C-01


    Description:

    Small Signal Schottky: SCS751V-40
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
    Download: pdf

2016-05-03



  • PCN No#:2016-02-03C-01


    Description:

    MOSFET : SSD12P10
    Package: TO-252(D-Pack)
    Description of Change(s): Original assembly factory EOL, thus Change assembly factory.
    Download: pdf

2016-02-03



  • PCN No#:2016-01-20C-01


    Description:

    MOSFET : SMG2328
    Package : SC-59
    Description of Change(s): To offer our customers the better products, we improved the wafer production process by replacing the orignal 6 inch wafer with 8 inch wafer.
    Download: pdf

2016-01-20



  • PCN No#:2015-11-01C-01


    Description:

    MOSFET : SSM0410
    Package: SOT-223
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-11-01



  • PCN No#:2015-11-01C-02


    Description:

    MOSFET : SSD10N20-400D
    Package: TO-252(D-Pack)
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-11-01



  • PCN No#:2015-10-21C-01


    Description:

    Transistor : CZD1182
    Package: TO-252(D-Pack)
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-02


    Description:

    Transistor : 2SB1386
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-03


    Description:

    Transistor : 2SB1188
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-04


    Description:

    Transistor : CZT5551
    Package: SOT-223
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-05


    Description:

    Transistor : MMBT2222Q
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-06


    Description:

    Transistor : PZT2907A
    Package: SOT-223
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-07


    Description:

    Transistor : BCP5551
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-08


    Description:

    Transistor : BCP5401
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-09


    Description:

    Transistor : BCP772
    Package: SOT-89
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-10


    Description:

    Transistor : BCP56
    Package: SOT-223
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-10-21C-11


    Description:

    Transistor : BCP69
    Package: SOT-223
    Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
    Download: pdf

2015-10-21



  • PCN No#:2015-08-10C-01


    Description:

    MOSFET : SST3585S
    Package: SOT-26
    Description of Change(s): Original assembly factory EOL, thus Change assembly factory.
    Download: pdf

2015-08-10



  • PCN No#:2015-07-01C-01


    Description:

    MOSFET : SPR40N06
    Package : PR-8PP
    Description of Change(s): In order to enhance the effectiveness of the product, wafer size change from 6-inch to 8-inch.
    Download: pdf

2015-07-01



  • PCN No#:2015-05-01C-01


    Description:

    MOSFET : SMS318
    Package : SOT-23
    Description of Change(s): Comparing with AgPdAu wires, AuPdCu wires have lower electrical resisting conductivity with improved thermal performance and can help to reduce the defects such as broken wire.
    Download: pdf

2015-05-01



  • PCN No#:2015-04-01C-01


    Description:

    Small Singal Switching : 1N4148W
    Package: SOD-123
    Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
    Download:  pdf

2015-04-01



  • PCN No#:2015-04-01C-02


    Description:

    Small Singal Switching : 1N4448W
    Package: SOD-123
    Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
    Download:  pdf

2015-04-01



  • PCN No#:2015-04-01C-03


    Description:

    Small Singal Switching : BAV16P
    Package: SOD-123
    Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
    Download:  pdf

2015-04-01



  • PCN No#:2014-11-15C-01


    Description:

    Bridge Diode
    Package : DB-1S
    Affected Product(s) : DB101S~DB107S
    Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
    Download: pdf

2014-11-15



  • PCN No#:2014-11-15C-02


    Description:

    Bridge Diode
    Affected Product(s) : DB101~DB107, DB1501~DB1507
    Package : DB-1
    Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
    Download: pdf

2014-11-15



  • PCN No#:2014-08-22C-01


    Description:

    Diode > High Efficiency
    Package : DO-27
    Affected Product(s) : HER307G
    Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
    Download: pdf

2014-08-22



  • PCN No#:2014-08-22C-02


    Description:

    Bridge Diode
    Package : DB-1S
    Affected Product(s) : DB1501S~DB1507S. DB201S~DB207S.
    Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
    Download pdf

2014-08-22



  • PCN No#:2014-08-01C-01


    Description:

    Diode > Fast Rectifier : FR207G
    Package : DO-15
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-02


    Description:

    Package : SOT-563
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-03


    Description:

    Package : SC-59
    Affected Product(s) : 2SB1197K
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-05


    Description:

    Package : SOT-363
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-06


    Description:

    Package : SOT-523
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-07


    Description:

    Package : SOT-553
    Affected Product(s) : KS05L4. KS05LL4. SEMY1. EMG11
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-08


    Description:

    Package : SOT-26
    Affected Product(s) : KS05E4. 2SD2045. BC727.
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-09


    Description:

    Package : SOT-323
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-10


    Description:

    Package : SOT-353
    Affected Product(s) : SCS481N. UMN1N. KS05J4. KS33J4. MMDT4944.
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-11


    Description:

    Package : SOT-23
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-12


    Description:

    Package : SOT-143
    Affected Product(s) : KS05B3. KS05B4. KS05BL4.
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-13


    Description:

    Package : SOD-723
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-14


    Description:

    Package : SOD-323
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-15


    Description:

    Package : SOD-523
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-08-01C-16


    Description:

    Package : SOD-123
    Affected Product(s) : See Attachment
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
    Download:  pdf

2014-08-01



  • PCN No#:2014-06-20C-01


    Description:

    Package : 1206
    Affected Product(s) : See Attachment
    Description of Change(s): The reason we changed carry tap is to prevent the material attached.
    Download:  pdf

2014-06-20



  • PCN No#:2014-06-01C-01


    Description:

    Diode > High Efficiency : HER207G
    Package : DO-15
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
    Download:  pdf

2014-06-01



  • PCN No#:2014-06-01C-02


    Description:

    Diode > Fast Rectifier : FR107G
    Package : DO-41
    Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
    Download:  pdf

2014-06-01



  • PCN No#:2014-05-05C-01


    Description:

    Package : WBFBP-02C
    Affected Product(s) : Product list as attachment
    Description of Change(s) : In order to improve Production efficiency for product .
    Download : pdf

2014-05-05



  • PCN No#:2014-03-31C-01


    Description:

    Small Signal Schottky: SCS495D
    Description of Change(s): Change assembly factory for SCS495D
    Download: pdf

2014-03-31



  • PCN No#:2014-01-01C-01


    Description:

    Package : SMA
    Affected Product(s) : SMA Package Product
    Description of Change(s): Add lead frame vendor.
    Download:  pdf

2014-01-01



  • PCN No#:2014-01-01C-02


    Description:

    Package : SMB
    Affected Product(s) : SMB Package Product
    Description of Change(s): Add lead frame vendor.
    Download:  pdf

2014-01-01



  • PCN No#:2014-01-01C-03


    Description:

    Package : SMC
    Affected Product(s) : SMC Package Product
    Description of Change(s): Add lead frame vendor.
    Download:  pdf

2014-01-01



  • PCN No#:2014-01-01C-04


    Description:

    Package : SOD-123FL
    Affected Product(s) : SOD-123FL Package Product
    Description of Change(s): Add lead frame vendor.
    Download:  pdf

2014-01-01



  • PCN No#:2013-12-01C-01


    Description:

    Package : SD-123FL
    Affected Product(s) : SOD-123FL Package Product
    Description of Change(s) : Increase capacity for SOD-123FL package .
    Download :  pdf

2013-12-01



  • PCN No#:2013-11-14C-01


    Description:

    Diode : Low vf schottky
    Package : SMA
    Affected Product(s) : Product list as attachment
    Description of Change(s) : Tapping Reel Size Revised .
    Download : pdf

2013-11-14



  • PCN No#:2013-09-03C-01


    Description:

    Diode
    Package :SMA. SMB
    Affected Product(s) : ES13A. ES23B.
    Description of Change(s): Anti-Static package implementation.
    Download:  pdf

2013-09-03



  • PCN No#:2013-08-19C-01


    Description:

    MK-23 & MK-18 Forming Category
    Package: DO-27
    Description of Change(s): Forming Dimension Adjustment .
    Download:  pdf

2013-08-19



  • PCN No#:2013-08-01C-001


    Description:

    Package : SMA. SMB
    Affected Product(s) : Product list as attachment
    Description of Change(s) : Anti-Static package implementation.
    Download : pdf

2013-08-01



  • PCN No#:2013-08-01C-01


    Description:

    U-6R Forming Category
    Package: DO-27
    Description of Change(s): Forming Dimension Adjustment .
    Download:  pdf

2013-08-01



  • PCN No#:2013-07-25C-01


    Description:

    Transistor : 2SC2873
    Package: SOT-89
    Description of Change(s): Copper Bonding Wire Implementation.
    Download:  pdf

2013-07-25



  • PCN No#:2013-06-24C-01


    Description:

    Diode
    Package :SMC
    Affected Product(s) : Product list as attachment.
    Description of Change(s): Anti-Static package implementation.
    Download:  pdf

2013-06-24



  • PCN No#:2013-06-17C-01


    Description:

    Bridge Diode:MD1S~MD7S
    Package :MDS
    Description of Change(s): Change assembbly factory for MDS package.
    Download:  pdf

2013-06-17



  • PCN No#:2013-01-02C-01


    Description:

    Diode
    Affected Product(s) : MK-18 & MK-23 Forming types
    Description of Change(s): Anti-Static package implementation.
    Download:  pdf

2013-01-02



  • PCN No#:2012-12-01C-01


    Description:

    MOSFET : SMG2301
    Package : SC-59
    Description of Change(s): Wire Bonding Change
    Download: pdf

2012-12-01



  • PCN No#:2012-11-30C-01


    Description:

    Diode: MUR420, MUR460, MUR480, HER507G,HER301G~HER307G, 1N5406G~1N5408G, SF25G, SF33G~SF35G and SF53G~SF55G
    Package: DO-15,DO-27(DO-201)
    Description of Change(s): Date Code Addition for Marking
    Download: pdf

2012-11-30



  • PCN No#:2011-06-15C-01


    Description:

    Transistor : 2SB1188
    Package: SOT-89
    Description of Change(s): Copper Bond Wire Implementation
    Download: pdf

2011-06-15



  • PCN No#:2010-12-23C-01


    Description:

    Small Singal Switching : MMBD318 series
    Package: SC-59
    Description of Change(s): MMBD318 Series Package Size Revision
    Download:  pdf

2010-12-23



  • PCN No#:2010-11-01C-01


    Description:

    Package : SOT-523
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-11-01



  • PCN No#:2010-07-01C-01


    Description:

    Package : TO-92L
    Affected Product(s) : 2SA1013. 2SA684. 2SB764L. 2SC1383L. 2SC1384L. KSA708. KSA928ATL. KTA1023. KTC1027. KTC3205
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-07-01



  • PCN No#:2010-07-01C-02


    Description:

    Package : TO-92MOD
    Affected Product(s) : 2SA1020. 2SA965TM. 2SB647A. 2SC2235TM. 2SC2655. 2SD667A
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-07-01



  • PCN No#:2010-07-01C-03


    Description:

    Package : TO-92S
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-07-01



  • PCN No#:2010-07-01C-04


    Description:

    Package : TO-92
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-07-01



  • PCN No#:2010-07-01C-05


    Description:

    Package : TO-126
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-07-01



  • PCN No#:2010-05-01C-02


    Description:

    Package : SOD-123LH
    Affected Product(s) : 1N4148LW
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-05-01



  • PCN No#:2010-05-01C-03


    Description:

    Package : SOD-123
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-05-01



  • PCN No#:2010-05-01C-04


    Description:

    Package : SOD-323L
    Affected Product(s) : SCS355V. MMDL914. UDZS***B SERIES
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-05-01



  • PCN No#:2010-05-01C-05


    Description:

    Package : SOD-323
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-05-01



  • PCN No#:2010-05-01C-06


    Description:

    Package : SOD-523
    Affected Product(s) : As attachment
    Description of Change(s): Changing bonding wire material from gold to copper.
    Download:  pdf

2010-05-01



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