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PCN No#:2021-10-15-C-01
Subject:
Adding plastic reel material on all devices in SMA, SMB and SMC package
Description:
Description of Change(s): This change is being implemented to improve manufacturing efficiency and to better support long-term demand for the affected products. Plastic Reels and Paper Reels will be supplied in parallel.
Download: 
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2021-10-15 | |
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PCN No#:2021-09-16C-01
Subject:
Specification change
Description:
MOSFET : SSG4835P-C
Description of Change(s): In order to improve production efficiency and product yield, we relax product specifications. No change in wafer and assembly.
Download:
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2021-09-16 | |
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PCN No#:2021-04-21C-01
Subject:
Add second assembly house
Description:
Schottky Rectifier
SBL30U60-C. SBR2045.SBR30200R. SBL20U150-C. SBL30U100-C. SBL30U150-C. SBR20200.
Description of Change(s): In order to meet market demand and improve product production efficiency, we add second assembly house
Download:
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2021-04-21 | |
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PCN No#:2020-12-10C-01
Subject:
Jiangyin Kangqiang Electronics Co., ltd. will be relocated to its parent company Ningbo Kangqiang Electronics Co., Ltd
Description:
MOSFET
Description of Change(s): According to the overall planning and development requirements proposed by the supplier, to form a unified, large-scale and intensive production management mode to improve work efficiency and ......
Download:
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2020-12-10 | |
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PCN No#:2020-06-01C-01
Subject:
Change assembly factory.
Description:
MOSFET : SST3585S
Description of Change(s): Original assembly factory EOL, thus Change assembly factory.
Download:
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2020-06-01 | |
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PCN No#:2020-05-08C-01
Subject:
Change SOD-123 Lead Frame from 4 Rows to 12 Rows
Description:
Schottky Rectifier
Low VF Schottky Rectifier
Package:SOD-123
Description of Change(s): In order to improve production efficiency and avoid shortage of raw materials, we have added a secondlead frame.
Download:
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2020-05-08 | |
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PCN No#:2019-10-08C-01
Subject:
Tapping Reel Material Revised
Description:
TVS : S2FL*** SERIES. S4FL*** SERIES
Description of Change(s): Original reel is easy to deformation, thus, we change the reel.
Download:
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2019-10-08 | |
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PCN No#:2019-05-20C-02
Subject:
Change the assembly house
Description:
Bridge : S4GBL80-C
Description of Change(s): The original assembly house was EOL; thus, we changed to the second assembly house.
Download:
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2019-05-20 | |
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PCN No#:2019-04-01C-01
Subject:
Process Optimization
Description:
MOSFET : SSD15P10-C
Description of Change(s): In order to enhance the effectiveness of the product, we change the wafer size from 6-inch to 8-inch.
Download:
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2019-04-01 | |
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PCN No#:2019-04-01C-02
Subject:
Process Optimization
Description:
MOSFET : SPR14P10-C
Description of Change(s): In order to enhance the effectiveness of the product, we change the wafer size from 6-inch to 8-inch.
Download:
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2019-04-01 | |
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PCN No#:2018-10-24C-01
Subject:
Process Optimization
Description:
MOSFET : SCG3139K-C
Package: SOT-523
Description of Change(s): In order to enhance the effectiveness of the product, wafer size change from 6-inch to 8-inch.
Download:
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2018-10-24 | |
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PCN No#:2018-09-04C-01
Subject:
Lead free to halogen free
Description:
Diode
Package : SMA/SMB/SMC
Affected Product(s) : Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2018-09-04 | |
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PCN No#:2018-08-24C-01
Subject:
Tapping Reel Quantity Revised
Description:
Liner LDO Regulator : STP1117Sxx Series
Package: SOT-223
Description of Change(s): In order to unify the quantity of reels , so we change the quantity.
Download:
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2018-08-24 | |
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PCN No#:2018-06-29C-01
Subject:
Update the marking
Description:
Package : GBJ/GBL/GBP/GBU/JB/KBJ/KBP
Affected Product(s) : New series bridge rectifier .
Description of Change(s): To meet UL's requirement that any given part number should correspond to only one part. thus, we change the marking.
Download:
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2018-06-29 | |
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PCN No#:2018-05-04C-01
Subject:
Lead free to halogen free
Description:
Package : SOD-123
Affected Product(s) : SOD-123 Package of Schottky, Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2018-05-04 | |
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PCN No#:2018-05-04C-02
Subject:
Lead free to halogen free
Description:
Package : SOD-323
Affected Product(s) : SOD-323 Package of Schottky, Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2018-05-04 | |
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PCN No#:2018-05-04C-03
Subject:
Lead free to halogen free
Description:
Package : SOD-123
Affected Product(s) : SOD-123 Package of Low VF Schottky, Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2018-05-04 | |
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PCN No#:2018-04-13C-01
Subject:
Add clip vendor
Description:
Package : TO-277D , TO-277B
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of material, and enhance the speed of delivery, thus, we add a new clip vendor.
Download:
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2018-04-13 | |
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PCN No#:2017-12-08C-01
Subject:
Lead free to halogen free
Description:
Transistor
Package : SOT-723
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-12-08 | |
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PCN No#:2017-12-08C-02
Subject:
Lead free to halogen free
Description:
Transistor
Package : SOT-223
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-12-08 | |
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PCN No#:2017-12-08C-03
Subject:
Lead free to halogen free
Description:
MOSFET
Package : SOP-8
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-12-08 | |
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PCN No#:2017-12-08C-04
Subject:
Lead free to halogen free
Description:
Small Signal Diode
Package : WBFBP-02C
Affected Product(s) : WBFBP-02C Package of Small Signal Diode, Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-12-08 | |
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PCN No#:2017-12-08C-05
Subject:
Lead free to halogen free
Description:
Diode
Package : WBFBP-02C
Affected Product(s) : WBFBP-02C Package of ESD Protection Diode, Such as attachments.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-12-08 | |
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PCN No#:2017-05-25C-01
Subject:
Lead free to halogen free
Description:
MOSFET
Package : SC-59
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-02
Subject:
Lead free to halogen free
Description:
Transistor
MMBT3904
Affected Product(s) : MMBT3904
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-03
Subject:
Lead free to halogen free
Description:
Transistor
MMBT3906
Affected Product(s) : MMBT3906
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-04
Subject:
Lead free to halogen free
Description:
MOSFET
Package : SOT-723
Affected Product(s) : SOT-723 Package of Mosfet, inclouding SSN3043. SSN3134K. SSN3139K and SSN3541.
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-05
Subject:
Lead free to halogen free
Description:
DIODE
Package : SOD-123JD
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-06
Subject:
Lead free to halogen free
Description:
DIODE
Package : SMAM
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-05-25C-07
Subject:
Lead free to halogen free
Description:
MOSFET
Package : SOT-89
Affected Product(s) : See Attachment
Description of Change(s): To meet EU environment requirement, we implement halogen free to our products.
Download:
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2017-05-25 | |
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PCN No#:2017-02-03C-01
Subject:
Tapping Reel Quantity Revised
Description:
Package : SOP-8
Affected Product(s) : See Attachment
Description of Change(s): In order to improve Production efficiency for product .Tapping Leader Size 13 inch (Quantity:2.5K ) to 13 inch (Quantity:4K ).
Download:
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2017-02-03 | |
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PCN No#:2017-01-10C-01
Subject:
Tapping Reel Size Revised
Description:
Package : SOT-223
Affected Product(s) : See Attachment
Description of Change(s): In order to improve Production efficiency for product .Tapping Leader Size 7 inch (Quantity:1K ) to 13 inch (Quantity:2.5K ).
Download:
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2017-01-10 | |
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PCN No#:2016-12-20C-01
Subject:
Add anti-counterfeiting code on the marking.
Description:
Mosfet & Transistor : See Attachment
Description of Change(s): In order to improve the product traceability and anti-counterfeiting, we change the marking.
Download:
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2016-12-20 | |
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PCN No#:2016-05-03C-01
Subject:
Add assembly vendor
Description:
Small Signal Schottky: SCS751V-40
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
Download:
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2016-05-03 | |
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PCN No#:2016-02-03C-01
Subject:
Change the assembly house.
Description:
MOSFET : SSD12P10
Package: TO-252(D-Pack)
Description of Change(s): Original assembly factory EOL, thus Change assembly factory.
Download:
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2016-02-03 | |
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PCN No#:2016-01-20C-01
Subject:
Change the wafer size and the marking
Description:
MOSFET : SMG2328
Package : SC-59
Description of Change(s): To offer our customers the better products, we improved the wafer production process by replacing the orignal 6 inch wafer with 8 inch wafer.
Download:
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2016-01-20 | |
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PCN No#:2015-11-01C-01
Subject:
Change the assembly house.
Description:
MOSFET : SSM0410
Package: SOT-223
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-11-01 | |
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PCN No#:2015-11-01C-02
Subject:
Change the assembly house.
Description:
MOSFET : SSD10N20-400D
Package: TO-252(D-Pack)
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-11-01 | |
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PCN No#:2015-10-21C-01
Subject:
Change the assembly house.
Description:
Transistor : CZD1182
Package: TO-252(D-Pack)
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-02
Subject:
Change the assembly house.
Description:
Transistor : 2SB1386
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-03
Subject:
Change the assembly house.
Description:
Transistor : 2SB1188
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-04
Subject:
Change the assembly house.
Description:
Transistor : CZT5551
Package: SOT-223
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-05
Subject:
Change the assembly house.
Description:
Transistor : MMBT2222Q
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-06
Subject:
Change the assembly house.
Description:
Transistor : PZT2907A
Package: SOT-223
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-07
Subject:
Change the assembly house.
Description:
Transistor : BCP5551
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-08
Subject:
Change the assembly house.
Description:
Transistor : BCP5401
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-09
Subject:
Change the assembly house.
Description:
Transistor : BCP772
Package: SOT-89
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-10
Subject:
Change the assembly house.
Description:
Transistor : BCP56
Package: SOT-223
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-10-21C-11
Subject:
Change the assembly house.
Description:
Transistor : BCP69
Package: SOT-223
Description of Change(s): The original assembly house, GTM Corporation, was shut down; thus, we change to the second assembly house.
Download:
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2015-10-21 | |
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PCN No#:2015-08-10C-01
Subject:
Change assembly factory.
Description:
MOSFET : SST3585S
Package: SOT-26
Description of Change(s): Original assembly factory EOL, thus Change assembly factory.
Download:
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2015-08-10 | |
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PCN No#:2015-07-01C-01
Subject:
SPR40N06 : Process Optimization
Description:
MOSFET : SPR40N06
Package : PR-8PP
Description of Change(s): In order to enhance the effectiveness of the product, wafer size change from 6-inch to 8-inch.
Download:
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2015-07-01 | |
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PCN No#:2015-05-01C-01
Subject:
Enhance electrical characteristics and increase capacity.
Description:
MOSFET : SMS318
Package : SOT-23
Description of Change(s): Comparing with AgPdAu wires, AuPdCu wires have lower electrical resisting conductivity with improved thermal performance and can help to reduce the defects such as broken wire.
Download:
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2015-05-01 | |
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PCN No#:2015-04-01C-01
Subject:
Changing lead frame
Description:
Small Singal Switching : 1N4148W
Package: SOD-123
Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
Download:
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2015-04-01 | |
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PCN No#:2015-04-01C-02
Subject:
Changing lead frame
Description:
Small Singal Switching : 1N4448W
Package: SOD-123
Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
Download:
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2015-04-01 | |
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PCN No#:2015-04-01C-03
Subject:
Changing lead frame
Description:
Small Singal Switching : BAV16P
Package: SOD-123
Description of Change(s): In order to enhance the effectiveness of the product, to achieve the better electrical conductivity of the copper lead frame
Download:
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2015-04-01 | |
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PCN No#:2014-11-15C-01
Subject:
Change assembly factory for DB-1S package
Description:
Bridge Diode
Package : DB-1S
Affected Product(s) : DB101S~DB107S
Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
Download:
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2014-11-15 | |
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PCN No#:2014-11-15C-02
Subject:
Change assembly factory for DB-1 package
Description:
Bridge Diode
Affected Product(s) : DB101~DB107, DB1501~DB1507
Package : DB-1
Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
Download:
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2014-11-15 | |
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PCN No#:2014-08-22C-01
Subject:
HER307G : Change assembly factory for HER307G
Description:
Diode > High Efficiency
Package : DO-27
Affected Product(s) : HER307G
Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
Download:
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2014-08-22 | |
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PCN No#:2014-08-22C-02
Subject:
Change assembly factory for DB-1S package
Description:
Bridge Diode
Package : DB-1S
Affected Product(s) : DB1501S~DB1507S. DB201S~DB207S.
Description of Change(s): Original assembly factory EOL, thus we change assembly factory; The new assembly factory Good-ARK electronics CO., LTD, ....
Download
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2014-08-22 | |
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PCN No#:2014-08-01C-01
Subject:
Add assembly vendor
Description:
Diode > Fast Rectifier : FR207G
Package : DO-15
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-02
Subject:
Add a molding vendor
Description:
Package : SOT-563
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-03
Subject:
Add a molding vendor
Description:
Package : SC-59
Affected Product(s) : 2SB1197K
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-05
Subject:
Add a molding vendor
Description:
Package : SOT-363
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-06
Subject:
Add a molding vendor
Description:
Package : SOT-523
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-07
Subject:
Add a molding vendor
Description:
Package : SOT-553
Affected Product(s) : KS05L4. KS05LL4. SEMY1. EMG11
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-08
Subject:
Add a molding vendor
Description:
Package : SOT-26
Affected Product(s) : KS05E4. 2SD2045. BC727.
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-09
Subject:
Add a molding vendor
Description:
Package : SOT-323
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-10
Subject:
Add a molding vendor
Description:
Package : SOT-353
Affected Product(s) : SCS481N. UMN1N. KS05J4. KS33J4. MMDT4944.
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-11
Subject:
Add a molding vendor
Description:
Package : SOT-23
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-12
Subject:
Add a molding vendor
Description:
Package : SOT-143
Affected Product(s) : KS05B3. KS05B4. KS05BL4.
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-13
Subject:
Add a molding vendor
Description:
Package : SOD-723
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-14
Subject:
Add a molding vendor
Description:
Package : SOD-323
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-15
Subject:
Add a molding vendor
Description:
Package : SOD-523
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-08-01C-16
Subject:
Add a molding vendor
Description:
Package : SOD-123
Affected Product(s) : See Attachment
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new vendor.
Download:
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2014-08-01 | |
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PCN No#:2014-06-20C-01
Subject:
Tapping Changed
Description:
Package : 1206
Affected Product(s) : See Attachment
Description of Change(s): The reason we changed carry tap is to prevent the material attached.
Download:
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2014-06-20 | |
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PCN No#:2014-06-01C-01
Subject:
Add assembly vendor
Description:
Diode > High Efficiency : HER207G
Package : DO-15
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
Download:
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2014-06-01 | |
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PCN No#:2014-06-01C-02
Subject:
Add assembly vendor
Description:
Diode > Fast Rectifier : FR107G
Package : DO-41
Description of Change(s): In order to avoid shortage of the material, and enhance the speed of delivery, thus, we add a new assembly house.
Download:
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2014-06-01 | |
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PCN No#:2014-05-05C-01
Subject:
Tapping Quantity Revised
Description:
Package : WBFBP-02C
Affected Product(s) : Product list as attachment
Description of Change(s) : In order to improve Production efficiency for product .
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2014-05-05 | |
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PCN No#:2014-03-31C-01
Subject:
SCS495D: Change assembly factory for SCS495D
Description:
Small Signal Schottky: SCS495D
Description of Change(s): Change assembly factory for SCS495D
Download:
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2014-03-31 | |
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PCN No#:2014-01-01C-01
Subject:
Add lead frame vendor
Description:
Package : SMA
Affected Product(s) : SMA Package Product
Description of Change(s): Add lead frame vendor.
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2014-01-01 | |
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PCN No#:2014-01-01C-02
Subject:
Add lead frame vendor
Description:
Package : SMB
Affected Product(s) : SMB Package Product
Description of Change(s): Add lead frame vendor.
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2014-01-01 | |
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PCN No#:2014-01-01C-03
Subject:
Add lead frame vendor
Description:
Package : SMC
Affected Product(s) : SMC Package Product
Description of Change(s): Add lead frame vendor.
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2014-01-01 | |
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PCN No#:2014-01-01C-04
Subject:
Add lead frame vendor
Description:
Package : SOD-123FL
Affected Product(s) : SOD-123FL Package Product
Description of Change(s): Add lead frame vendor.
Download:
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2014-01-01 | |
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PCN No#:2013-12-01C-01
Subject:
Increase capacity for SOD-123FL package
Description:
Package : SD-123FL
Affected Product(s) : SOD-123FL Package Product
Description of Change(s) : Increase capacity for SOD-123FL package .
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2013-12-01 | |
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PCN No#:2013-11-14C-01
Subject:
Tapping Reel Size Revised
Description:
Diode : Low vf schottky
Package : SMA
Affected Product(s) : Product list as attachment
Description of Change(s) : Tapping Reel Size Revised .
Download :
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2013-11-14 | |
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PCN No#:2013-09-03C-01
Subject:
Anti-Static package implementation
Description:
Diode
Package :SMA. SMB
Affected Product(s) : ES13A. ES23B.
Description of Change(s): Anti-Static package implementation.
Download:
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2013-09-03 | |
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PCN No#:2013-08-19C-01
Subject:
Forming Dimension Adjustment .
Description:
MK-23 & MK-18 Forming Category
Package: DO-27
Description of Change(s): Forming Dimension Adjustment .
Download:
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2013-08-19 | |
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PCN No#:2013-08-01C-001
Subject:
Anti-Static package implementation
Description:
Package : SMA. SMB
Affected Product(s) : Product list as attachment
Description of Change(s) : Anti-Static package implementation.
Download :
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2013-08-01 | |
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PCN No#:2013-08-01C-01
Subject:
Forming Dimension Adjustment .
Description:
U-6R Forming Category
Package: DO-27
Description of Change(s): Forming Dimension Adjustment .
Download:
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2013-08-01 | |
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PCN No#:2013-07-25C-01
Subject:
Copper Bonding Wire Implementation
Description:
Transistor : 2SC2873
Package: SOT-89
Description of Change(s): Copper Bonding Wire Implementation.
Download:
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2013-07-25 | |
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PCN No#:2013-06-24C-01
Subject:
Anti-Static package implementation
Description:
Diode
Package :SMC
Affected Product(s) : Product list as attachment.
Description of Change(s): Anti-Static package implementation.
Download:
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2013-06-24 | |
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PCN No#:2013-06-17C-01
Subject:
MD1S~MD7S : Change assembbly factory for MDS package
Description:
Bridge Diode:MD1S~MD7S
Package :MDS
Description of Change(s): Change assembbly factory for MDS package.
Download:
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2013-06-17 | |
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PCN No#:2013-01-02C-01
Subject:
Anti-Static package implementation
Description:
Diode
Affected Product(s) : MK-18 & MK-23 Forming types
Description of Change(s): Anti-Static package implementation.
Download:
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2013-01-02 | |
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PCN No#:2012-12-01C-01
Subject:
SMG2301 : Wire Bonding Change
Description:
MOSFET : SMG2301
Package : SC-59
Description of Change(s): Wire Bonding Change
Download:
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2012-12-01 | |
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PCN No#:2012-11-30C-01
Subject:
Date Code Addition for Marking
Description:
Diode: MUR420, MUR460, MUR480, HER507G,HER301G~HER307G, 1N5406G~1N5408G, SF25G, SF33G~SF35G and SF53G~SF55G
Package: DO-15,DO-27(DO-201)
Description of Change(s): Date Code Addition for Marking
Download:
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2012-11-30 | |
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PCN No#:2011-06-15C-01
Subject:
2SB1188 : Copper Bond Wire Implementation
Description:
Transistor : 2SB1188
Package: SOT-89
Description of Change(s): Copper Bond Wire Implementation
Download:
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2011-06-15 | |
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PCN No#:2010-12-23C-01
Subject:
MMBD318 Series Package Size Revision
Description:
Small Singal Switching : MMBD318 series
Package: SC-59
Description of Change(s): MMBD318 Series Package Size Revision
Download:
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2010-12-23 | |
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PCN No#:2010-11-01C-01
Subject:
Copper Bonding Wire Implementation
Description:
Package : SOT-523
Affected Product(s) : As attachment
Description of Change(s): Changing bonding wire material from gold to copper.
Download:
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2010-11-01 | |
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PCN No#:2010-07-01C-01
Subject:
Copper Bonding Wire Implementation
Description:
Package : TO-92L
Affected Product(s) : 2SA1013. 2SA684. 2SB764L. 2SC1383L. 2SC1384L. KSA708. KSA928ATL. KTA1023. KTC1027. KTC3205
Description of Change(s): Changing bonding wire material from gold to copper.
Download:
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2010-07-01 | |
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PCN No#:2010-07-01C-02
Subject:
Copper Bonding Wire Implementation
Description:
Package : TO-92MOD
Affected Product(s) : 2SA1020. 2SA965TM. 2SB647A. 2SC2235TM. 2SC2655. 2SD667A
Description of Change(s): Changing bonding wire material from gold to copper.
Download:
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2010-07-01 | |
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